Used MEYER BURGER DS 271 #293648553 for sale

MEYER BURGER DS 271 is a crystal growing, sawing and slicing equipment designed for the growth and fabrication of large, single crystal substrates for use in high performance optoelectronic and semiconductor substrates. The system features a unique four-axis diamond cutting saw, where a single rotating vertical diamond saw blade is used to manufacture shapes out of larger wafers. This allows for cutting of even large substrates into smaller chips, allowing for the highest possible performance in optoelectronic and semiconductor materials. The unit is designed to be used in conjunction with a Meyer-Burger Grown Crystal Growth (GCG) chamber. The GCG chamber allows for the growth of high-quality single crystal material, giving users the capability to shape the substrates according to their needs, with exceptional results. The machine's integrated computer control, or CCC, allows users to accurately control the growing and slicing operations. To ensure optimal performance, the CCC tool can adjust the cutting parameters and the saw blade speed and diamond particle size to ensure the highest quality substrates. The asset includes multiple features for precision cutting and shaping. It is equipped with a substrate de-pulverizer model, which ensures that any particulate materials are completely removed from the substrate, with no risk of damage or contamination. The sawing and slicing equipment also includes an in-situ diamond wire polisher, allowing users to achieve a smooth and consistent surface texture on the created substrates, allowing for even higher-performance optoelectronic and semiconductor materials. Finally, the system includes an integrated cooling unit, which allows for the rapid cooling of substrates after the shaping process is complete. This helps ensure that the substrates retain their integrity and are not adversely affected by the process itself. In summary, MEYER BURGER DS271 is a crystal growing, sawing and slicing machine designed for high performance optoelectronic and semiconductor substrates. The tool offers superior accuracy and repeatability through its advanced CCC computer control asset and integrated diamond wire polisher. It also boasts a substrate de-pulverizer model and integrated cooling equipment to ensure the highest possible performance for the created substrates.