Used MEYER BURGER DS 271 #9185553 for sale

MEYER BURGER DS 271 is a crystal growing, sawing, and slicing equipment. In the field of technology, the term "crystal growing, sawing, and slicing" comprises several different processes used to create crystals, saw them into slabs, and then slice them into wafers. This system is particularly suitable for wafer slicing of silicon, quartz, sapphire, ruby, and other technical materials. MEYER BURGER DS271 is suitable for use in a wide range of research, power and telecommunications applications. It is a highly advanced unit that has been designed to provide fast, precise cutting and wafer slicing capabilities. The growing, sawing, and slicing process allows researchers to produce crystals with well-defined surfaces and layers that will have minimal distortion. The machine comprises a growing chamber, a water-cooled, diamond-coated diamond-wire Saw, automated sawing and slicing control, an industrial-grade robot with a 4-way arm, a gas scrubber, and an x-ray chamber. The growing chamber can be filled with raw material, such as quartz, silicon, or other materials that need to be processed. It is then heated to the necessary temperature in order to start the crystal growth process. The sawing and slicing process is automated with the help of the 4-way arm robot, which is capable of sawing, slicing, and depositing the new wafer into the designated module. The diamond wire Saw is used to cut the large crystal slabs into individual wafers with consistent thickness and uniform edges. The gas scrubber ensures that dust particles are removed for a clean cut. Finally, the x-ray chamber is used to control the thickness and orientation of the wafer. DS 271 is a powerful and accurate tool that is capable of producing high-quality wafers with uniform surfaces and layers. The asset is a great asset to researchers, power applications, and telecommunications industries as it offers a highly efficient, reliable, and cost-effective way to produce wafers with advanced precision.