Used MEYER BURGER DW 288 P6 #9228788 for sale

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ID: 9228788
Vintage: 2012
Diamond wire saw 2012 vintage.
MEYER BURGER DW 288 P6 is a crystal growing, sawing and slicing equipment that is used in the semiconductor industry for the production of various wafers for electronic components. This system uses a channeled growth unit, or CCD, to synthesize and grow the single crystal base material. The CCD is then used to slice the crystal into single crystal wafers of predetermined thickness. The unit uses a specialized chamber where the CCD is placed. In the chamber, single crystal wafers are fed from a specialized feeder. The feeder then places the single crystal wafers onto the CCD, which is powered by two large-scale DC power supplies. The power supplies are used to provide the energy necessary for the CCD's operations, including the growth and slicing processes. In the growth phase, the single crystal wafers are placed in a specialized furnace which rapidly and precisely heats the crystal wafers to the predetermined temperature. The furnace then cools the crystal wafers slowly while the temperature and other growth parameters are monitored and adjusted. At the end of the growth phase, the CCD is ready to slice the single crystal wafers into single-crystal wafers. The slicing phase begins with the release of a precisely positioned tool carrier into the CCD chamber which holds a slicing saw for the cutting of the single crystal wafers. The slicing saw is used to make slots in the single crystal wafers which define the overall shape and size of the slices. Once this is done, the slicing saw is manually moved along the CCD until it reaches the slices which need to be cut. Once the slices are cut, they are manually placed onto the carrier, which is then connected to a conveyor belt and transported to the sawing station. The sawing station uses specialized blades to cut the slices into wafers of predetermined shapes and sizes. The wafers are then placed on a tray or a specialized holder which is used to transport the wafers to the next production station. Once the slicing and sawing processes are complete, the wafers are ready for inspection and packaging. DW 288 P6 is a reliable, high precision machine that can be used in a variety of industrial applications that require the production of single crystal wafers for electronic components.
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