Used MEYER BURGER DW 288 P6 #9240804 for sale
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ID: 9240804
Diamond wire saws
Used to make solar wafer
Wire web length: 650 mm
Work piece dimensions: 165 × 165 mm
Wire guide roller axis distance: 390 mm
Wire speed: 30 m/Sec
Wire acceleration: 8 m/S²
Wire on spool: Up to 10,000 m
Water-based cutting fluid
Wafer thickness: 100 μm(mono), 140 μm(multi)
Workpiece holders: 1 × 650 mm, 2 × 325 mm
For 180 micron plates / DW288-03 multi wafer / DW288-03 mono wafer
Productivity, wafer / year / 4,679,188 / 6,244,598
Productivity, MW / year / 21.1 / 32.2
Diameter of a basis of the diamond wire, micron / 70 / 60.
MEYER BURGER DW 288 P6 equipment is one of the industry-leading crystal growing, sawing and slicing systems used in scientific research. This reliable machine enables scientists and researchers to easily and accurately create crystal samples in a variety of sizes. It offers a full range of crystal parameters so users can customize the desired size and shape of their samples. The system is based on concentrated monochromatic lightwaves generated by second harmonic generation (SHG) in a non-linear crystal. This allows users to obtain a high degree of homogeneity and unprecedented uniformity in the size and shape of their samples. The propagation of the lightwaves is further controlled by an optical confinement unit made up of multiple mirrors. This machine also enables users to easily adjust the intensity and divergence angle of the lightwaves. All of this ensures that the produced samples will exhibit perfect optical characteristics. DW 288 P6 tool also uses a patented, multi-parameter control technology that enables users to adjust the parameters of the crystal growth process. With this technology, users can control everything from the temperature of the solution to the time of exposure for the best possible results. It also offers a smart sample-direction monitoring asset that allows users to precisely control and repeat the direction of growth for the most consistent crystals. MEYER BURGER DW 288 P6 model has a unique slicing station that enables users to manually slice large crystal blocks into thin slices and wafers. This ensures a clean, wafer-like finish and improved mirror surface quality. The slicing mechanism is adjustable to provide maximum control over the cutting angle, speed, and thickness of the slice. Finally, DW 288 P6 equipment comes with a comprehensive software package that facilitates remote operation of the system. This includes support for multiple protocols and an advanced graphical user interface for monitoring and controlling the entire crystal growing process. This ensures users can obtain the highest quality crystals with the desired characteristics.
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