Used MEYER BURGER DW 288 S6 #9395156 for sale
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ID: 9395156
Vintage: 2015
Wire saw
WM2
(2) Cutting fluid tanks with panel
Wire guide rolls
Web length: 650 mm
Maximum workpiece: 6.5"
Axis distance: 390 mm
Wire speed: 30 m/sec
Wire acceleration: 10 m/s²
Minimum wire diameter: 100 μm
Maximum wire tension: 45N
Rocking angle: ±12
Cutting fluid tank: 240
Does not include rocking unit
2015 vintage.
MEYER BURGER DW 288 S6 Crystal Growing, Sawing & Slicing Equipment is an advanced, fully automated system specifically designed for the efficient production of single crystal wafers. DW 288 S6 consists of three main components - a crystal growing oven, a sawing station and a slice/polish station. The crystal growing oven employs a temperature gradient technique, which increases the yield of single crystals from the melt. Features include precise temperature control and uniformity, high-vacuum capabilities and the capacity to accept a wide range of crucibles and substrates. The sawing station is equipped with high-frequency motors specifically designed to accurately cut through hard materials such as silicon and other single crystal substrates. The cutting operation is performed in a vacuum environment, which prevents thermal damage during the process. The station is equipped with a high-precision, single crystal diamond blade, which can be used to tailor the size and shape of the slices to customers' requirements. The slice/polish station has been designed specifically to produce high-quality, single, uniform slices, without any damage to the material. The station is equipped with a manually operated wheel, which polishes the sliced substrates on both sides, thus reducing defects and extending substrate lifetime. Also included is an automated surface inspection unit, which performs automated checks of the surface of the slices and provides accurate real-time feedback to the operator. Together, MEYER BURGER DW 288 S6 crystal growing, sawing and slicing machine provides a complete, efficient solution for producing single crystal wafers. The tool is ideal for industrial applications such as microelectronics, telecommunications, laser and optics and optoelectronics, and can be used by crystal growth and slicing experts alike.
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