Used MEYER BURGER DW 288 #293645365 for sale

MEYER BURGER DW 288 is an advanced semiconductor manufacturing equipment designed to perform crystal growing, sawing, and slicing operations with a high degree of accuracy. This system provides an integrated solution for forming shaped wafers and dies with a precision grade of less than one-fiftieth of a millimeter. DW 288 is composed of three main components. The first component is the crystal growing unit, which provides a range of single-crystal silicon (Si) materials equipped with a CVD source, an in-situ Si source, and an annealing furnace. The in-situ source enables the growth of 30-degree Si crystals up to four centimeters in diameter and up to a thickness of one millimeter. The CVD source enables Si deposition rate up to ten times faster than traditional methods. The crystal growth is monitored in real-time using its optical microscope. The second component is the sawing machine, which includes an automatic wire saw that is used to split the Si layers into separate die. The saw features a steel-clad diamond wire that is fed from an oscillating or rotating spool. It is operated in either a manual or automatic mode, allowing for precise cutting along predetermined coordinates. The third component is the slicing tool, which employs a specially designed rotating blade that is capable of slicing wafers into a variety of shapes and sizes. The asset is also equipped with a digital scale that is calibrated to measure the thickness of the cut wafer down to 0.01 millimeters. The blade can be rotated in left or right direction to help achieve the desired thickness. MEYER BURGER DW 288 model offers a number of advantages such as fast and accurate cutting, high precision, and minimal thermal deformation. It is also equipped with several safety features that ensure safe operation. The equipment can be used to create various types of integrated circuits, including high power, microwave, and micro-electro-mechanical systems.