Used MEYER BURGER DW 288 #293664687 for sale

MEYER BURGER DW 288 is a crystal growing, sawing and slicing equipment for the production of crystalline wafers with semi-automatic features. The system offers a high degree of flexibility for all production stages, from growing and axial sawing, through to high precision slicing and processing of the resultant wafers. The unit is based on a robust and reliable design that enables it to handle the production of 15 to 200 micrometer thick wafers from 2", 3", 4", and 6" substrates. It is designed to minimize consumption of media, water and energy, as well as providing a safe and user-friendly operating environment. The machine is highly automated with PLC (Programmable Logic Controllers) and digital robot controllers for crystal growth, sawing and slicing processes. The main components consist of a multi-axial sawing unit, slicing unit, handling unit, robot controller, control unit, and software. The main features of DW 288 crystal growing, sawing and slicing systems are: Full automated production line that can process from 2", 3", 4" and 6" substrates Thickness control of sawed wafer from 15 to 200 micrometer Full adjustable feeding and driving forces for all production steps Large-scale temperature control to avoid thermal stress during slicing High precision slicing of wafers with uniform thickness Automated cleaning systems for continuous production with low scrap rate Monitoring of process environment and quality of the produced wafers Easy maintenance with on-site service team These features result in production of high quality goods with a low scrap rate with minimized environmental impacts and operational costs. The tool is capable to meet the needs of all industries requiring high precision and crystalline slicing. It can also be customized to meet the individual needs of customers.