Used MEYER BURGER DW 288 #9228478 for sale

MEYER BURGER DW 288 is an advanced crystal growing, sawing, and slicing equipment that enables precision cutting and polishing of group III-V semiconductor material. It utilizes a monocrystalline crystal source and state-of-the-art diamond blades to produce efficient and uniform wafer slices. The system can process material thicknesses ranging from 0.5 to 4.5 millimeters, making it suitable for both thin and thick substrates. It is equipped with a laser guided precision XY stage which provides repeating accuracy of < 0.5 microns and ensures the flatness and angularity of the cutting plane. A vacuum chuck is included for secure sample holding and perfect substrate alignment. DW 288 unit can be used for various material types and thicknesses. It supports both single-crystal and multi-crystal sources, as well as a variety of crystal growth methods. It can be used to create device-grade wafers for applications ranging from MEMS sensors to high-power LEDs. The machine can also be used to create thin films for applications such as OLED displays. For crystal growing applications, MEYER BURGER DW 288 tool utilizes a drop-in crucible furnace asset which features highly uniform temperature distribution. It is capable of achieving temperature distributions of 4-5°C across the crucible, enabling high quality crystal growth. The model also supports fast-growing, low-temperature methodologies for rapid manufacturing of large quantities of devices. The sawing capabilities of DW 288 consist of both dry and wet sawing processes. The wet saw utilizes a chemical etching process to minimize the saw damage on the sample surface, and to ensure high quality finished slices. For increased flexibility, the wet saw can be merged with the laser cutting process, allowing the operator to precisely cut different parts of the crystal with the abrasive and the laser cutting wheels. MEYER BURGER DW 288 is equipped with an advanced slicing equipment that enables production of slices with minimal loss and high yield. It utilizes a sophisticated sawframe-controlled slicing process and a three-axis linear motion system, allowing it to process a variety of substrates for production of highly uniform slices. Overall, DW 288 is a powerful and efficient crystal growth, sawing, and slicing unit suitable for production of high quality, device-grade substrates. It is packed with advanced features and will help drive your production processes to the highest level of efficiency.