Used MEYER BURGER RTD 820 #9229438 for sale

ID: 9229438
Wafer Size: 8"
Vintage: 2008
Multi wire saw, 8" With standard web, 2" (3) Motors Cut height: 8" Cut width: 8" Maximum wire length: 3 Kms Compressed air required: 80 psi /-5 cfm, 55 N/cm² - 140 L/min Tangential cutting Water spray system: Standard Door interlock: Standard Includes: Reel to reel diamond multi wire saw For cutting work pieces up to 200 x 200 Maximum ±6° of rock Integrated cooling system with pump and tank volume Sealed cabinet with door interlock Set of tools Manuals Power supply: 200-230 V, 50/60 Hz 2008 vintage.
MEYER BURGER RTD 820 crystal growing, sawing & slicing equipment utilizes state-of-the-art technology to perform precision cutting and slicing of crystals into various shapes and sizes. The system uses advanced diamond wafering blades to produce accurately sized wafers from single-crystal and polycrystalline materials, with minimum waste. The computer-controlled manufacturing process offers automated material loading, cutting and slicing, along with an accurate registration unit for accurate results. RTD 820 boasts a wide range of features designed to maximize efficiency and accuracy. Its high speed cutting and slicing capabilities can process multiple crystals simultaneously, with speeds up to 4,500 mm/s. MEYER BURGER RTD 820 also features an integrated wafer stacking loader, allowing for multiple slicing operations while minimizing required setup times. RTD 820 is designed for use in a variety of industrial settings, including semiconductor and optoelectronics production. The machine utilizes a host of state-of-the-art components to provide precision cutting and slicing of crystals. Using the latest diamond wafering blades, crystalline materials can be accurately performed to sizes of up to 140 µm in thickness. MEYER BURGER RTD 820 also incorporates a sophisticated software controlling tool that helps to simplify the manufacturing process. The integrated software ensures that precision and accuracy are maintained during all cutting and slicing operations. RTD 820 also features a high-powered cooling asset and an automatic cleaning model to prevent dust and debris from accumulating on the wafer's surface. MEYER BURGER RTD 820's considerable advantages and sophisticated features ensure that it is an industry leader when it comes to crystal growing, sawing & slicing. The equipment is designed for maximum efficiency, speed, accuracy, and safety, delivering optimal results for industrial production. For companies looking for efficient and precise crystal growth and production systems, the MEYERBURGER RTD 820 is the perfect choice.
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