Used MEYER BURGER RTD 820 #9395970 for sale

MEYER BURGER RTD 820 is a versatile crystal growing, sawing and slicing equipment meant for use by professionals working with silicon and other semiconductor wafers and crystals. It is designed to produce uniform, high-quality wafers and crystals from raw materials. RTD 820 utilizes a fast and accurate laser technology for crystallization of the substrate, with the laser beam travelling along the substrate surface. Furthermore, an electro-optic galvanometer is used for precise sawing and slicing of the crystal with a cutting speed of 12,000 μm/s. The system consists of several main parts: the crystal growing equipment, the substrate loading station, the substrate holder, the sawing and slicing devices, and the sawing and slicing software. The crystal growing equipment includes components like the substrate and the crucible, where the process of crystallization take place. The substrate loading station is designed for easy and accurate placement of substrates with automatic alignment and inclination adjustment. The substrate holder supports the substrate during the process. The sawing and slicing devices, included in the unit, utilize a laser cutting technology that offers an adjustable cutting speed between 0 and 12,000 μm/s. The software, included in the machine, provides user-friendly control with a graphical user interface (GUI). It also implements a wide range of functions, like the visualization of cutting paths and the definition of sawing thickness, as well as cutting speed. All in all, MEYER BURGER RTD 820 is an optimal solution for any company looking for a reliable and efficient tool to grow, saw and slice semiconductor wafers and crystals. It is reliable and safe to use, providing the user with the highest quality of cut. Its easy-to-use GUI makes it an ideal tool for effective and efficient processing of substrates.