Used MEYER BURGER TS 23 #9019705 for sale
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ID: 9019705
Vintage: 1984
Saw with guiding system
22" Head
415 Voltage
Currently palleted
1984 vintage.
MEYER BURGER TS 23 crystal growing, sawing and slicing equipment is a modern, state-of-the-art machine designed for top research and production of high-precision silicon wafer production. The system offers reliable, stable and repeatable results. MEYER BURGER TS23 is a three-stage unit optimized for growing silicon crystals, sawing and slicing the grown wafers into chips and finally grinding and polishing the chips. The three-stage machine includes a Growth Chamber, a Slicing Chamber, and a Finishing Chamber. The Growth Chamber is equipped with a vertically mounted, ultra-high temperature hot zone, where the silicon-containing gas is heated to about 1470°C. At the high temperature, the gas molecules ionize and the silicon-containing gas is decomposed. The silicon evaporates and is deposited as a thin, uniform, single crystal layer on the substrate surface. The Growth Chamber can be equipped with either horizontal or vertical substrate holders The Slicing Chamber is capable of sawing, slicing and pocketing the wafer. It is equipped with a High Vacuum Slicing Head, where the wafer can be cut into pieces in a controlled, very accurate manner, precisely parallel to the crystal surface. The Finishing Chamber is dedicated for grinding and polishing of the wafer pieces. To this end, it is equipped with precise grinding and polishing tools, such as diamond-coated abrasive. TS-23 is user-friendly and easy to maintain. The main components of the tool are is centrally accessible and user-friendly due to its self-aligning chamber components. The integrated safety features of the asset help to ensure user safety. The model is equipped with an emergency stop button, a laser eye protection equipment and a protective glovebox system. MEYER BURGER TS-23 unit is suitable for a range of applications including MOCVD, MBE and BCD production, as well as production of semiconductor and MEMS device wafers. By using the machine, researchers and companies can produce high-quality, high-precision and reliable silicon wafers.
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