Used MEYER BURGER TS 23 #9209450 for sale

MEYER BURGER TS 23 is a multi-functional machine designed for crystal growth, sawing and slicing. It is suitable for sawing monocrystalline and polycrystalline materials such as wafers or thin-film substrates. MEYER BURGER TS23 is equipped with an advanced, multi-level software package that makes it easy to control, monitor, and analyze each step of the process. The software controls all the parameters related to the cutting, sawing and grinding processes such as speed, pressure, and feeding. The equipment is also capable of profile and surface analysis to ensure that the cut is optimal and the surface quality meets the highest standards. TS-23 is capable of performing single crystal, polycrystalline and thin-film growths, as well as sawing and slicing of different material types. The system features a dynamic, digitalized, self-monitoring control panel, which allows the user to precisely control and monitor the operation parameters and the results achieved. In addition, the unit is equipped with automatic loading and unloading devices, as well as a mechatronic motion platform (FlexTec), which makes it possible to perform all the growth, sawing and slicing operations with a high degree of precision. TS23 is also equipped with a high-precision inverter pulse cutting technique, ensuring that the material is precisely cut without any warping or distortion. It also includes a continuous speed-up machine for substrates, which helps to maintain a constant speed during sawing without the need for manual adjustment. TS 23 is specifically designed to meet the needs of the semiconductor industry, with the ultimate goal of ensuring the highest levels of quality and productivity. With its advanced technologies, intuitive software, world-class materials processing, and precise cutting, sawing and slicing capabilities, MEYER BURGER TS-23 is the perfect choice for demanding crystal growth, sawing, and slicing processes.