Used MEYER BURGER TS 23 #9283638 for sale

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ID: 9283638
Vintage: 2013
ID Saw Compressed air pressure: 5-10 bar Amount: 20 m³/h Vacuum: 0.1 - 0.4 bar Amount: 8 m³/h Electric connected load: ca. 4 kW Backup: max. 30 A Coolant and detergent pressure: 1.5 - 4 bar Amount: max. 384 l/h Exhaust air extraction: 500 m³/h Noise level: ≤ 80 dB (A) Spindle speeds: 2800 RPM Voltage: 50 Hz, 3 x 380 Volts Power required: 4.0 HP 2013 vintage.
MEYER BURGER TS 23 is a leading crystal growing, sawing and slicing equipment designed for the production of semi-conducting materials with increased accuracy. It is designed to improve the yield of semi-conducting materials for a variety of applications, from laboratory research to large-scale production of wafers. MEYER BURGER TS23 offers efficient crystal growth and cutting processes, due to the combination of a rapid thermal cycle and advanced infrared heating system. The crystal growth and cutting processes rely on the crystal growth chamber, where temperatures can be precisely controlled with an accuracy of 0.5 °C, allowing the crystal to grow in the same homogeneous environment as the substrate itself. This ensures that the crystal grows in the same perfect shape as its original container. TS-23 is equipped with a high precision diamond saw permitting precise cutting of the crystals into slabs and wafers. The saw ensures accurate and consistent results, along with the ability to perform multiple cuts on the same wafer. The unit also includes an integrated laser end-point detection machine, able to detect when the cutting process is complete, with a resolution of 1 nanometer. TS23 also includes a single-wafer handling tool, providing automated movement of the wafers through the asset. It is able to support wafers from up to 200mm diameter, ensuring accurate positioning of the wafer onto the saw. The sawing capabilities are further enhanced with a flexible positioning model, allowing precise alignment of the wafer onto the diamond saw. The equipment is also equipped with a lift system, allowing superb process stability and repeatability for both wafer handling and sawing processes. MEYER BURGER TS-23 unit also offers advanced measuring and data acquisition capabilities, allowing precise analysis of the materials. The integrated software and data processing machine is able to analyse the vibration events and other process details using advanced algorithms and methods. TS 23 is designed to provide the highest level of accuracy and repeatability for crystal growing, sawing, and slicing processes. With its state-of-the-art technologies and capabilities, it is able to meet the exacting requirements of semiconductor material production. Thus, MEYER BURGER TS 23 is the perfect choice for companies seeking optimum production performance, reliability, and precision for their semi-conducting materials.
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