Used MEYER BURGER TS 23 #9409189 for sale

MEYER BURGER TS 23 is an automated crystal growing, sawing and slicing equipment designed especially for advanced 3" and 4" wafer production. The system comprises of a well-optimized combination of electrochemical crystal growth, sawing and slicing technologies. MEYER BURGER TS23 electrochemical crystal growth unit can produce advanced multi-crystalline ingots with a wide selection of starting materials including GaN and related compounds. The growth chambers are specially designed to provide uniform temperature control and low thermal gradients for optimum growth performance. The machine is also equipped with advanced process monitoring systems for precise control over the electrochemical process. The tool is equipped with an advanced X-Ray deflecting sawing unit, which is optimized for 3" and 4" wafer production. The sawing unit is designed to provide smooth saw cuts with minimal power consumption and maximum productivity. Additionally, the asset is equipped with a multiple-finger pick-and-place automation model that can be used to accurately place and align the wafers before sawing. TS-23 is further equipped with a slicing equipment that allows for precise cross-sectional cuts of the wafers. This includes a patented rotating slicing technique that minimizes wafer defects. In addition, the system features an advanced laser scanning microscope for precise inspection of the cut wafers. In short, TS23 is a fully automated unit that allows for precise processing of 3" and 4" multi-crystalline ingots. The machine is well-equipped with advanced process monitoring tools and slicing technologies to optimize the performance and yield of the crystal growing and slicing processes. Additionally, the tool is designed to provide maximum throughput with minimum energy consumption and maximum productivity.