Used PVA TEPLA SR-110 #9386473 for sale

PVA TEPLA SR-110 is a state-of-the-art crystal growing, sawing, and slicing equipment. The system is designed specifically for cutting and machining sapphire, silicon, gallium arsenide, zinc selenide, and other difficult-to-cut crystalline materials. It features a patented, high-precision crystal securing unit that enables users to quickly and accurately turn raw material into finished components. SR-110 crystal growing machine uses a proprietary combination of chemical geometries and growth parameters to produce high-quality, micron-scale components. The growth process is contained within a vacuum-sealed chamber that shields the raw materials from the effects of external contaminants. An advanced control tool enables rapid and accurate adjustment to the parameters needed to control size and shape during the growth process. PVA TEPLA SR-110's sawing and slicing capabilities enable fine precision cutting to tolerances of less than one hundredth of a millimeter. The asset can cut up to 20mm thick wafers without any edge chipping. Its patented seesawing technique ensures that slices remain square and consistent in shape. The integrated micro-positioners enable users to adjust the sawing parameters to produce zero-tolerance cuts. SR-110's features also include the ability to accurately create monocrystalline parts by using the perfecting-annealing process. This process eliminates dislocation walls and bubbles from the interior of the crystal, ensuring uniformity of the structure. The end result is a component with exacting tolerances and consistency of crystal properties. Finally, PVA TEPLA SR-110 is capable of yielding components at an accelerated rate, reducing the cost of production while maintaining product quality. The model yields results that conform precisely to customer specifications. This precision, coupled with its versatile growth, sawing, and slicing capabilities, make SR-110 an ideal solution for creating high-end crystalline products.