Used RDN Smart Pull #9267203 for sale

RDN Smart Pull is an advanced, automated, crystal growing, sawing and slicing equipment that is used to produce high-quality single-crystal wafers that are suitable for applications in advanced microelectronics and optoelectronics. This system features an integrated grower, sawer, and slicer that enable users to control each step of the process from online and onsite. The grower element of the unit is designed for the controlled growth of single crystals from the melt. The grower uses the concept of boundary mobility controlled (BMC) growing to form a single-crystal ingot from high-purity monomers or polymers precursors. The crystallization temperature can be set to optimize the growth rate and create a uniform crystal lattice structure. During the growth process, the machine also allows users to measure and adjust the monomers concentration and seed orientation. The sawer is designed for high-speed, high-precision cutting of the grown crystal ingots into thin discs. The sawer features a low vibration saw motor as well as a precision cutting stage for maximum accuracy. This tool can be used to cut various materials, including quartz, silicon, sapphire, and other materials with a minimum diameter of 150 mm and a maximum thickness of 2 mm. The slicer is designed to cut the discs into thin wafers, which are then used in the manufacture of optoelectronics and microelectronics components. The slicing process is carried out using computer-controlled diamond wire sawing technology. The asset has the capacity to slice wafers of a minimum thickness of 0.25 mm and a maximum thickness of 1 mm. Smart Pull model is an advanced, automated crystal growing, sawing, and slicing equipment that is designed to produce high-quality single-crystal wafers for a variety of applications. The grower, sawer, and slicer elements ensure a streamlined and precise process, allowing users to control each step of the process from online or onsite. This system can be used to cut various materials, such as quartz, silicon, sapphire, as well as other materials with a minimum diameter of 150 mm and a maximum thickness of 2 mm. The slicer can be used to cut wafers with a minimum thickness of 0.25 mm and a maximum thickness of 1 mm. This unit is perfect for use in advanced microelectronics and optoelectronics applications.