Used TAKATORI MWS-612DD #293806521 for sale

TAKATORI MWS-612DD crystal growing, sawing, and slicing equipment is a composite machine tool that is designed and built by TAKATORI Corporation, a Japanese engineering firm. It is an ideal machine system for producing precision semiconductor substrates, monocrystal lenses, and other thin film devices that require precise and accurate geometric shapes and sizes. This unit combines multiple highly advanced technologies, including diamond wire sawing and specialized slicing algorithms, to cut and shape the hard and brittle materials with supreme accuracy and speed. The machine is equipped with a high-end digital tablestage that makes it possible to position the workpiece with extraordinary accuracy. It is capable of producing crystal shape substrates and thin film layers with an accuracy that surpasses the milling accuracy of a commercially available microcomputer-controlled machine. Its cutting accuracy is as good as 0.050 microns. TAKATORI MWS 612DD consists of a high-precision, diamond-tipped wire saw that is capable of measuring and cutting the materials with extreme precision and speed. The saw is connected to a stepper motor and a programmable controller that allows it to be used in combination with the computer numerical control of the tool. As the wire saw is driven by the motion of the stepper motor, the saw can be used to shape exact geometries in hard and brittle materials. MWS-612DD is also equipped with a high-precision, optical stereomicroscope that is capable of accurately measuring the workpiece characteristics. This microscope provides the user with precise and real-time feedback on the surface parameters of the cutting material. It has a magnification that allows for the viewing of details as small as 0.01 microns. Along with the wire saw and optical microscope, MWS 612DD also includes an ultra-precision positioning asset, a specialized cutting controller, a fine dicing machine, and a slicing slicer. The positioning model ensures that the wire saw produces cuts of the highest accuracy and repeatability. The cutting controller is capable of controlling speed, cutting force, and depth of the wire saw cut. The fine dicing machine is responsible for final cutting of the slab into smaller pieces, while the slicing slicer shapes the thin film devices with exact precision and accuracy. TAKATORI MWS-612DD is capable of producing extremely accurate results that cannot be achieved with the commercially available machines. Its advanced technologies and high-precision components make it one of the most advanced and accurate crystal growing, sawing, and slicing equipment available in the market.