Used DATACON / BESI APM Equipment for sale

DATACON, now a part of BESI APM, is one of the leading manufacturers in the semiconductor and electronics industry. With a history dating back several decades, DATACON has established itself as a reliable and trustworthy provider of advanced packaging solution systems. The company specializes in the production of precision die attachers, which are crucial components in the semiconductor manufacturing process. Die attachers are designed to securely affix semiconductor chips onto substrates, allowing for efficient assembly and seamless integration within electronic devices. DATACON's die attachers boast state-of-the-art technology, enabling high placement accuracy and throughput rates, resulting in enhanced overall performance and reliability. Apart from die attachers, DATACON also offers a range of other advanced packaging solutions. These include wire bonders, encapsulation systems, and other equipment that contribute to the efficient assembly and packaging of semiconductor chips. With their cutting-edge technology and steadfast commitment to innovation, DATACON's products are widely recognized and sought after by industry professionals worldwide. In 2017, DATACON was acquired by BESI APM, forming a formidable partnership in the semiconductor manufacturing sector. BESI APM, a leader in advanced packaging and high-speed bonding processes, expanded its technological capabilities further with the integration of DATACON's expertise and product portfolio. This acquisition has enabled the combined entity to provide comprehensive and highly reliable packaging solutions to meet the ever-increasing demands of the industry. In summary, DATACON, now a part of BESI APM, has built a stellar reputation for its exceptional range of die attachers and advanced packaging solutions. The company's dedication to technological innovation and industry leadership has positioned it as a reliable partner for semiconductor manufacturers worldwide.