Used ALPHASEM 9003 #9299698 for sale

ALPHASEM 9003 is a die attacher used to accurately bond dice to targets, such as semiconductor substrates. It is designed to offer a reliable, high-precision die attach process for semiconductor fabrication and other related processes. 9003 is composed of a uniquely designed vacuum carrier head, secured to a computer-controlled, X-Y-Z motion platform. This offers the ability to precisely move the attached die in all directions as needed. The platform also offers the ability for self-adjustment. This allows the device to remain consistent in its motion and precision overtime. The die attach process is monitored and controlled using visual cues from the digital monitor, which can view and monitor the application and/or itself. The image on the monitor is digitized and used to control and measure the process. It is also used to identify any defects and anomalies, allowing the device to be able to correct them as needed. ALPHASEM 9003 also offers an advanced control system to allow for precise application and parameters control. This includes features like adjusting the vacuum pressure, drive force, and die attach speed. Furthermore, it also provides an ability for the controller to compensate for changes in external conditions like substrate type and surface conditions. One of the primary features of 9003 device is its advanced built-in capability for automated die characterisation. It helps to ensure the highest accuracy in the die attach process, as it can detect any defects and problems before they progress, and take action to fix them. Additionally, ALPHASEM 9003 has several safety features to protect both the process and the associated personnel. These features are specifically designed to identify faults and take appropriate action to prevent any potential damage and/or disruption in the process. 9003 is a cutting edge device made from high-quality materials and components. Its robust construction and precise attach process make it an ideal solution for various high-precision processes, both industrial and prototype. It is ideal for attaching copper leadframes or other substrates to die, as it ensures a reliable bond with minimal risk of failure. ALPHASEM 9003 is a must-have device for any die attach focused process.