Used ALPHASEM AG DB606 #18794 for sale

ALPHASEM AG DB606 is a highly reliable and powerful Automatic Die Bonding Machine that is impeccably designed for die attachment of medium-to-large surface mount components. This machine is highly suitable for mass production of SMD chips and other tiny surface mount components. AG DB606 comes with servo driven motion control and a powerful vision equipment that enhances precision and accuracy of the die attachment process. This machine is equipped with a PC-based controller that is well integrated with the vision system. It can detect and pick-up chips as small as 0402 and package sizes up to UBGA. The vision unit is incredibly precise and can accurately place the die while executing a precise discharging operation on the substrate. This machine is equipped with a die judging accuracy of ±30 µm, which further improves the efficiency and accuracy of the die attachment process. It also features an automatic-loading machine that allows for precise and automated loading and unloading of the substrates. The machine also comes with a patented head cleaning agent that minimizes the risk of particle accumulation on the bonding head, thus maintaining a clean and precise working environment. Thanks to its built-in X-Y Coordinated table and precision CCD camera, ALPHASEM AG DB606 is able to target nearly all type of die perfectly and accurately. The machine is extremely precise and efficient and has adjustable speed and pressure modes that can be adapted as per the demands of the task. Its powerful adhesive application also makes it a suitable choice for high-volume production lines. In addition to its die attaching capabilities, the machine is equipped with a stable and advanced SPI (Soldering Paste Inspection) tool that effectively checks the wettability and spread of the soldering paste on the substrate. The machine has the capability to complete all die attaching tasks with the utmost ease and accuracy. All in all, AG DB606 is an ideal machine for efficient and precise die attaching of SMD chips and other surface mount components. It boasts great precision, stability, and productivity making it an invaluable asset for any production line.