Used ALPHASEM E8003 #9169960 for sale

ALPHASEM E8003 is an automated die attacher specifically designed for the assembly of lead frames and die into a package. E8003 is a Semi-Automated tool with the semi-automated mode increasing the throughput and quality of the die attach process. The equipment is capable of up to 10 chip attachment sites per cycle with adjustable force and XYZ offset. ALPHASEM E8003 is equipped with a vision system that is used to sense the exact chip-to-pad placement, allowing for precise die placement. The unit can also be manually adjusted in order to ensure that all of the chips being attached are at the correct orientation and to the right position. The vision machine also allows for real-time, in-process inspection and error recognition. The tool is designed to accept any type of package and can be set up to work with lead frames, TO-220, or QFN packages. E8003 is equipped with an auto-spin capability that ensures the die is spun into its optimal position for die attach. The adjustable force will ensure that the die is securely attached onto the pad. ALPHASEM E8003 is constructed to ensure lasting stability and reliability. The asset is equipped with a heavy-duty, stainless steel frame construction with a black oxide finish and vibration free operation. The model is also equipped with multiple interlocks that ensure safety while the equipment is in operation. E8003 also features quick setup, allowing for easy and fast job changes. ALPHASEM E8003 is designed to be a cost-effective and efficient chip attachment system. E8003 features a user-friendly, graphical interface that allows for fast and easy programing. ALPHASEM E8003 provides the highest quality and reliability, backed up by its intuitive software and maintenance program. The unit also provides a consistently low-cost per attach for all chip packages. E8003 is the perfect solution for any industrial or consumer die attach application. The machine is designed to provide a precise placement of die into packages with high accuracy and excellent repeatability. It is the perfect attachment option for any high-volume chip attachment. ALPHASEM E8003 provides a reliable and accurate attachment process for lead frames, TO-220, and QFN packages.