Used ALPHASEM LIAS #9249248 for sale

ALPHASEM LIAS is an automated die attach machine made by Nikon. It is designed for the job growth and high-volume requirements of automotive, consumer, and power semiconductor packages. LIAS employs an advanced dispensing mechanism that accurately places bumps of solder paste around each die with precision, allowing for a quick, efficient, and reliable die attach process. This precision is also achieved through ALPHASEM LIAS's advanced electronic vision which tracks and inspects each die individually, ensuring quality product alignment. This equipment also allows for a high degree of flexibility in production settings, as it can store up to 4 different die types simultaneously, allowing for a wide range of product customization. LIAS has a two-position tray and wafer travel system that eliminates the need for manual indexing of wafers, ensuring dependable production time. It also offers automated inline feedback for diagnosing process problems and further optimizing production. ALPHASEM LIAS features an intuitive, easy to use touchscreen interface with a range of available parameters for adjusting die attach conditions. This includes variables like head type, acceleration, die lay-down level, pick force, paste print speed, lay-down pressure and more, allowing the machine to be highly customized for any semiconductor production environment. Additionally, LIAS includes Die-Vision detection with integrated inspection, to ensure a low level of defects and maximum throughput. ALPHASEM LIAS has a sophisticated heating unit incorporated into its design, enabling the use of a variety of pastes and adhesives for attaching dies. This heating machine, in conjunction with Nikon's 'In-Line-Foam-Control' technology, ensures a precise application of paste/adhesive with each and every die. The application process optimally manages any residue, reducing waste and improving production efficiency. Overall, LIAS is a highly reliable automated die attaching solution, designed to meet the demands of the industry. It offers precision, flexibility, efficiency, and reliability, along with a comprehensive set of features to streamline your die attaching process and ensure a high quality product.