Used AMI / PRESCO 3100H #7801 for sale

AMI / PRESCO 3100H die attacher is a cost-effective and reliable die-bonding tool for high-precision wire-bonding components in the semiconductor manufacturing industry. AMI 3100H is designed to deliver repeatable, consistent results, and is suitable for attaching single WLCSP die and multiple die of different sizes. PRESCO 3100H's simple and intuitive design allows quick and easy setup with minimized operator input. It features a temperature-controlled hot plate, which ensures uniformly heated die, even when multiple die of different sizes and shapes are placed closely together. The onboard monitor also displays real-time temperature and pressure parameters. In addition, 3100H has a multi-die placement system that can accommodate various sizes and shapes of die, and is capable of swapping die without interrupting the cycle process. AMI / PRESCO 3100H's precision wirebond module is capable of attaching die with wires as small as 25 μm in diameter. Furthermore, it is equipped with an optional vision system for precision placement of die, ensuring high yields. Additionally, the advanced software embedded in AMI 3100H ensures easy programming and operation. The software also allows users to save and store parameters for multiple setups and retrieve them at any time. PRESCO 3100H is designed for use in the most demanding production areas and cleanrooms, thanks to its robust and compact size. Thanks to its sturdy construction, 3100H is capable of withstanding high temperatures and vibrations, and is able to function with minimal downtime. With its versatile design, AMI / PRESCO 3100H is also able to handle protective material such as kapton tape and epoxy layers. Overall, AMI 3100H Die Attacher is a highly reliable and cost-effective solution for die-bonding components in semiconductor manufacturing. With its robust construction and intuitive design, PRESCO 3100H is capable of providing consistent, repeatable results, making it an invaluable tool for any production facility.