Used ASM 889 #9193117 for sale

ASM 889 is a semi-automatic die attaching machine designed to increase production output for electronic devices. It is specifically designed to attach epoxy-coated dies to ceramic or aluminum substrate materials. 889 features a tiltable base that allows the user to accurately position the die in the exact spot desired as well as a pneumatically operated toggle gripper arm which enables the user to precisely apply the desired amount of force to the die during the attaching process. The machine allows for programmable parameters such as the amount of compression applied to the die and its position on the substrate. ASM 889's main advantages are its ability to precisely and reliably attach virtually any size of die without damaging the substrate. Its patented construction and accuracy allows for the size of the die to be accurately and reliably applied to any kind of substrate, such as alumina, beryllium oxide, or quartz. On top of that, 889 can also reliably attach multiple dies into a single package in a single pass. The multi-step process begins with a pre-heater chamber that heats the die in a controlled environment to a pre-selected temperature in order to help loosen the bond between the epoxy and the substrate. An automated vision system then verifies that the die is properly positioned on the substrate before the die attach table is used to mechanically align and attach the die in preparation for the adhesive or wire bonding process. When the bond is completed, a discharge valve allows the die-substrate combination to be dropped into an automated tray for the subsequent assembly process. The system also includes an optional monitoring station which allows operators to verify the correctness and quality of the die-to-substrate bond on a sub-micron level. ASM 889 is an excellent choice for increasing production output for high-precision components that require accurate die attach. Its accuracy, repeatability, and ability to quickly attach multiple dies in one pass makes it ideal for applications such as RF components, optoelectronics, and power devices that require a high degree of precision. Its tough construction, repeatable performance, and efficient operation make it the perfect choice for manufacturers who need reliable and accurate die attach solutions.