Used ASM AD 211 Plus #293607285 for sale

ASM AD 211 Plus is an automatic die attach machine designed for full volumetric die attach for a variety of semiconductor and optoelectronic applications. The primary purpose of the device is to attach dies to substrates and packages with extreme accuracy. The equipment comes with a variety of options to meet different customer needs. AD 211 Plus is a high performance model that offers the necessary components and options for high quality full die attachment. It's designed to allow the operator to easily and quickly change the necessary components to fit their specific application, enabling them to reduce setup time, as well as increasing throughput and accuracy. The machine is also equipped with a user-friendly and intuitive control panel, allowing for quick and easy system setting and monitoring. The machine features a heated vacuum manifold and a heated picker arm that can handle temperatures up to 425°C to ensure the quality and consistency of die attach operations. It also comes with a heat stabilized, resistively heated shaft that aids in providing accuracy and precision. It is also equipped with a barcode reader, allowing for in-unit operation control and data logging. ASM AD 211 Plus machine also features a full vision machine that provides an image of all applied dies. This ensures accurate, repeatable, and reliable die placement. The machine also comes with an autocalibration option that helps to maintain accuracy and allow for easy setup, recalibration, and repeatability. The machine uses a five-axis robotic arm controlled by an onboard PC that can be programmed to precisely place the die onto the substrate. AD 211 Plus is designed to provide high precision, repeatability, and reliability when attaching dies. The die attach machine is also compatible with a variety of substrate sizes, enabling it to be used on a wider range of applications. Overall, ASM AD 211 Plus is an efficient and accurate automatic die attach machine that ensures high quality and repeatability in die attach operations.