Used ASM AD 211 Plus #9394979 for sale

ASM AD 211 Plus is a die attacher designed for use in the assembly of microelectronic components, such as chips, modules, and other parts. It is capable of handling both through-hole as well as surface mount components. This machine is a "pillow type" die attacher, meaning that it uses a rubber pillow that compresses around the parts to be attached. This reduces "pick and place" errors that occur when a part is misaligned or not seated properly. AD 211 Plus has two feeders, one for through-hole parts and another for surface mount components. They both use a "Vibration-Assisted" feeding mechanism to ensure accurate placement of parts. The machine also features a Temperature Control Equipment that ensures the rubber pillow remains at a constant temperature during the attachment process, contributing to a higher level of accuracy and repeatability. This die attacher is designed to handle a variety of different sized parts, from 0.80mm to 3.3mm in length. It is equipped with a 300-degree head unit that allows for accurate adjustment of the die-attach pitch and depth, which increases its versatility and accuracy. It also features a socket unit and a chip slinger, which together allow for the accurate attaching of corner connectors and micro-connectors, respectively. In addition, it is capable of handles plated thru-hole die attach as well. Finally, ASM AD 211 Plus also features a high-speed digital vision system to ensure accurate placement of the parts. This unit inspects each part before the die attach process and allows for the incorporation of PCB fiducial recognition for more precise positioning. It also scans the parts after attachment and alerts the operator in the case of any misalignments. Overall, AD 211 Plus die attacher is a highly versatile and precise machine designed for the assembly of microelectronics. It delivers excellent repeatability and accuracy as well as a high-speed digital vision machine and temperature control capabilities. As a result, it is an ideal choice for any microelectronic assembly applications.