Used ASM AD 211 #9394951 for sale

ASM AD 211 is an automated die attachment equipment that can be used to attach dies to semiconductor wafers for use in electronic circuits. The system utilizes ultrasound technology and a special bonding adhesive to secure the dies to the wafers. The entire unit is designed to be a user-friendly and automated solution for the attaching of dies to wafers. AD 211 first starts by ultrasonically cleaning the wafer and die interface, removing any potential oxide contamination. The machine then applies a uniform coating of a special bonding adhesive to the interface of the wafer and the die. After that, the tool uses an ultrasonic bonding head to attach the die to the wafer. This process is done at a controlled pressure and temperature, thus ensuring a secure bond. Once the bonding process is complete, the asset automatically cleans up the excess adhesive, leaving the die fully attached to the wafer. ASM AD 211 model is designed to produce consistent results, with production rates of up to several wafers per minute being achievable depending on the size and type of die being used. Furthermore, the equipment can be coupled with a variety of inspection systems, allowing for quality control of the die bonding process. Overall, AD 211 is a reliable and automated die attachment system that can be used to produce secure bonds between the dies and the wafers. Through its use of ultrasonic bonding technology, the unit is able to achieve fast and consistent results while at the same time reducing the risk of defects. Furthermore, the machine can be coupled with a variety of inspection systems, allowing for thorough quality control of the die bonding process.