Used ASM AD 809-06 #9069897 for sale

ASM AD 809-06
Manufacturer
ASM
Model
AD 809-06
ID: 9069897
Die bonder.
ASM AD 809-06 is a die attacher that is specifically designed for use in the semiconductor industry. This state-of-the-art machine is manufactured by ASM Pacific Technology and is capable of attaching chips and other components to printed circuit boards (PCBs) at a rate of up to 8,000 components per hour. This machine combines highly accurate vision and optical alignment systems with modern motion control technology, allowing for precise die placement. The die attacher also has an option for a recirculating belt feeder, enabling it to continuously attach dies without interruption. AD 809-06 is capable of several die attach operations, consisting of die pick up, print registration, die placement and die bonding. This machine uses a dual vision system, allowing it to precisely locate and register components to be placed. It has an internal vacuum system to extrude and secure the die, and remove any excess material. The machine is powered by an advanced servo drive system, giving it fast acceleration and deceleration when changing direction. The machine also utilizes advanced control technology, allowing for fine adjustment to the speed and acceleration, contributing to the accuracy of the die placement operation. In addition to its mechanical features, ASM AD 809-06 has sophisticated software capabilities. This machine uses Electronic Software Firmware (ESF) to program and feed data into the memory of the machine, making it fast and efficient in executing different operations. It also has an intuitive graphical user interface, allowing for easy operation and monitoring of the machine. Additionally, AD 809-06 has capability for communications over the internet. This machine can access and upload data over the web, and utilize remote assistance when needed. This helps reduce downtime for repairs and troubleshooting, as well as making machine maintenance more efficient. Overall, ASM AD 809-06 is a reliable machine that combines advanced motion control technology, highly accurate vision and optical alignment systems and intuitive software systems into one unit. This die attacher can significantly increase the efficiency and accuracy of die placement and chip assembly operations in the semiconductor industry.
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