Used ASM AD 809 #293601510 for sale

ASM AD 809 is a high-precision die attach equipment for electronic chip and wafer mounting, used for flip-chip, die-bond, and die-attach applications. It is a servo-controlled, motorized system with a precision work area that optimizes the device attachment process with a wide array of options. ASM AD809 uses quality materials and components to guarantee highly accurate, repeatable movements with a minimum of micro dimple defects. Its optimized design delivers precise placement accuracy of highly reliable chip or wafer mounting. AD-809 is equipped with a QuickSet programmable controller that offers cascading menus, real-time graphical feedback, and quick parameter setting using intuitive user interface layouts. This controller also helps automate the setup, calibration, and status monitoring of the assembly process. The control unit also supports external data file handling, and has the flexibility of online parameter adjustment capability. The machine supports various communications interfaces such as the Ethernet, USB and RS232 interface, allowing connection to a variety of industrial communication networks. ASM AD-809 is mainly composed of a programmable motion tool and a manipulator. The motion asset includes a manipulator, gantry, and two bake ovens for curing the mounted devices. The manipulator has a single motor servo mechanism driven by a high-precision gear assembly that provides reliable, highly precise positioning of components in all three axes. The machine is also equipped with a vision model for precise image alignment and quality control. The vision equipment uses a wide range of auto-focus lenses and image processing algorithms to minimize marking and dimple defects. For increased safety, AD 809 is designed with an integrated proximity sensor to reduce contact with moving parts and prevent accidental damage. The system is also designed with automated error detection and analysis to address any unit failure before, during, or after the device mounting process. Overall, AD809 is a highly accurate die attach machine capable of positioning and attaching components as intended with a minimum of defects. Its optimized design, controller support, and safety features make it an ideal choice for automated chip and wafer mounting applications.