Used ASM AD 809 #293656564 for sale

Manufacturer
ASM
Model
AD 809
ID: 293656564
Vintage: 1997
Die bonder Power rating: 120 VAC, 50/60 Hz 1997 vintage.
ASM AD 809-01 is a die attacher developed by ASM Automation Systems & Materials GmbH for the assembly of concrete components/dies. This innovative attacher takes the guess work out of production processes by automatically positioning and fastening dies onto a substrate with ease and accuracy. AD 809-01 die attacher consists of a frame on which two linear axes are fitted in parallel, and an assembly head. On the frame, a sliding carriage is provided which holds the shape of die to be fastened. All components are motorized so that a robot arm carrying the assembly head can move around and position the die accurately. An optical system on the assembly head, with a resolution of 0.001mm, ensures precise positioning of the die for fastening. ASM AD 809-01 also has a range of other useful features. For instance, it allows the adjustment of die Force for different stages of the fastening processes such as locating, clamping and screwing. A monitor shows the positions of each motor and provides feedback on the process. It also has an electronic compensator which ensures the temperature fluctuations are compensated for accurate and repeatable positioning of the die. The attacher is also equipped with a safety system which ensures there is no danger to the operator or the product. Overall, AD 809-01 is an efficient and reliable machine for die placement and fastening. This attacher is used widely for the fabrication of various products such as vacuum die casting, metal stamping and glass molding. The assembly head runs smoothly without vibration and makes it possible to easily adjust die position and force. The attacher also features a self-regulating system that can automatically adjust for thermal expansion, ensuring optimal die control and precise positioning. Thanks to all these features, ASM AD 809-01 die attacher provides a reliable solution for the assembly of machine components and substrates.
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