Used ASM AD 809 #9248788 for sale

ASM AD 809 is a die attacher used for high speed chip and wire bonding. It is designed to effectively and efficiently attach fine wire or gold or aluminum wire to the semiconductor die. It has a wide range of applications in the automotive, medical, and consumer electronics industries. The die attacher is manufactured using a patented sequence with mechanical and pneumatic elements. It utilizes a CO2 laser head to accurately and quickly attach fine wire to small areas on the semiconductor die. The laser beam is controlled by a precision motion control equipment, which ensures a consistent and precise bond of each wire and die. The motion control system also allows the die attacher to handle different wire lengths and attachment patterns. ASM AD809 incorporates a vision unit that automatically inspects each wire before and after attachment to the die. The laser beam intensity, welding speed, and bonding depth can all be adjusted to ensure an accurate and long lasting bond. The vision machine also includes an image processing tool, which allows for a quick and efficient wire bonding process. In addition to its manual control, AD-809 can also be operated in an automated mode. This feature allows it to accommodate large quantities of wire bonding applications, greatly increasing throughput and productivity. The machine is equipped with a manually adjustable die positioner that can be used to accurately position each die prior to bonding. AD 809 is ideal for use in large-scale high-volume production and requires virtually no intervention or maintenance, making it a cost-effective and reliable solution. Its all-in-one design means it is fast and easy to set up and operate. It is also designed with a space saving in mind, making it ideal for both commercial and industrial applications.