Used ASM AD 809 #9276085 for sale
URL successfully copied!
ID: 9276085
Die bonder
Facility:
Power supply: 110/220 VAC, 50/60 Hz
Built-in vacuum pump: 50 cm Hg
Minimum compressed air supply: (4) Bars
Power consumption: 1.7 kW
Performance
Die size: 0.2 mm-1.5 mm
Rotary arm: Dual arm system
Bonding collet: Surface pick type
Bond force: 40 g-200 g
Cycle time: 600 msec
Wafer stage XY table:
Maximum travel: 6" x 6"
Resolution: 0.3 mil (7.62 µm)
Repeatability: ±0.2 mil (±5.08 µm)
PCB XY Table:
Travel area: 4" x 8"
Resolution: 0.3 mil (7.62 µm)
Repeatability: ±0.2 mil (±5.08 µm)
System accuracy
XY: ±2 mil (±0.05 mm)
￠: ±3°
Memory capacity:
(64) PCB's
(350) Bond points per PCB
PCB Dimension:
Maximum: 4" x 8"
Minimum: 1" x 0.47"
Pin length: 0.79".
ASM AD 809 is an automated die attacher that is designed to handle the die attaching process for a variety of industrial applications. It is capable of distinguishing between various substrate shapes and sizes, making it suitable for attaching various types of components and assemblies. ASM AD809 has a large capacity, allowing it to accept a wide range of components sizes. Its advanced motion control equipment can accurately adjust the speed and position of the attaching process, ensuring precise and reliable adhesion of the components. It has a programmable user interface board, enabling users to customize the settings and assign their own parameters to the die sharing process. The die attacher also offers adaptive pre-heating technology, which effectively reduces die and component adhesion time. This helps to save time and material costs. The device also has a built-in temperature sensor, allowing users to monitor and adjust the temperature during the die attaching process. AD-809 utilizes a universal suction system that can be configured to match the size and shape of die substrate being used. This can further reduce adhesive time and significantly improve adhesion reliability. Additionally, an in-line flip-flop unit is included, enabling users to quickly and easily inspect the process and thereby reduce potential risks of rework. The die attacher is also designed to provide a secure and reliable connection at low working temperatures, thereby reducing the risk of accidental short circuits and ensuring the highest level of component reliability. Finally, its sealed thermal module helps to prevent dust and liquid from entering the die attachment machine, thereby increasing the process's safety. In conclusion, ASM AD-809 is an industrial-grade automated die attacher that offers a reliable and accurate attaching process. It features an array of advanced features, including a user programmable interface board, pre-heating technology, universal suction tool, and more. Additionally, it supports low-temperature operation and is dust and liquid-resistant, helping to improve process safety.
There are no reviews yet