Used ASM AD 809M-08 #127738 for sale

ASM AD 809M-08 is a state-of-the-art automated die attacher with advanced robotic technology that revolutionizes semiconductor assembly and packaging. This device is designed to automate the process of bonding a variety of semiconductor packages such as BGA, QFN, and TQFP to substrates. The robot arm is capable of precise placement of dies while applying uniform pressure to ensure accurate and consistent die attach. The user-friendly design of AD 809M-08 allows it to be programmed to suit the requirements of any package or arrangement. The user-friendly operator software allows the setup process to be completed in a few steps, significantly reducing the time required for the attachment process. The stand-alone design of the equipment also reduces downtime due to maintenance and repair. Additionally, the device is equipped with an advanced vision system providing it with the capability to detect and avoid various types of errors, further increasing the manufacturing accuracy and efficiency. The unit is designed to be highly energy efficient, helping to reduce operational costs and emissions. ASM AD 809M-08 also comes with a complete range of additional features such as auto-visual identification, barcode scanning, and precise alignment of the die attach. The robust design of the machine ensures that it is highly reliable and provides a long service life. Overall, AD 809M-08 is an ideal die attacher for those looking to improve the efficiency and accuracy in semiconductor assembly and packaging. Its advanced robotic technology and user-friendly design makes it a great choice for those looking to streamline the die attach process. Its energy efficient operations and numerous additional features make the process of bonding dies to substrates much easier and more efficient.