Used ASM AD 809M-IL08 #9288772 for sale

Manufacturer
ASM
Model
AD 809M-IL08
ID: 9288772
Vintage: 1997
Automatic epoxy die bonder PCB LED 1997 vintage.
ASM 809M-IL08 is a high-flexibility die attacher for optimal utilization of material in compact electronic packaging. This equipment has a modern die-handling concept that enables a high-speed and low-cost die-tacking process. The 809M-IL08 die attacher is equipped with two stepper motors (one X-axis and one Y-axis) for precise two-dimensional positioning of the die for mass placement. The machine also has a robotic vision system for automated pick and place of micro components, which greatly reduces manual labor. The machine's unique die-tacking feature enables it to automatically attach dies to lead frames using a single tool. This is possible because the machine has a unique floating head, which is capable of self-adjusting its height to ensure that the dies are consistently placed. In addition to the die attachment function, ASM 809M-IL08 is also capable of heat sinking, allowing for further miniaturization of electronic components. This is achieved using a specialized air-cooled copper braid and heatsink, which can be quickly heated to release trapped gases during package fabrication. In terms of performance, ASM 809M-IL08 die attacher offers high speed, accuracy, and repeatability in die placement and other micro-assembly operations. The unit is also designed to accommodate different feeder layouts, including surface, pin/connector, and column feeders. Furthermore, ASM 809M-IL08 has an integrated laser pointer that allows operators to manually adjust the profile of the die. The laser machine also helps reduce the amount of manual labor required, as it eliminates the use of a microscope for aligning and mounting the die. Overall, ASM 809M-IL08 is a highly customizable die attacher that is capable of handling many different micro-assembly operations with precision and speed. Its automated vision tool and laser pointer help reduce manual labor, making it ideal for high-volume production applications.
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