Used ASM AD 809S #144549 for sale

ASM AD 809S die attacher is a high-precision equipment for attaching leadframes, wires, and other components to printed circuit boards. It is specifically designed for automated die bonding applications, where extremely precise positioning and attachment of parts is essential. AD 809S is equipped with advanced features which help ensure accuracy and high throughput. These include a tension monitor to ensure that the parts are securely and accurately attached, a corrections mode which allows for easy repositioning of parts in case of errors, and a zooming head that gives the operator a clear view and precise control of the parts. The unit is equipped with a high-resolution camera that enables precise placement of parts. Additionally, the equipment can be tailored to the user's application with adjustable settings, which improve accuracy and reduce stress on parts. This adaptability allows operators to create a wide variety of die-attach configurations and maintain a tight tolerance. ASM AD 809S is also equipped with a vision system for verifying part position and validating part placement. This unit includes a selection of programmable pick and place functions, as well as a variety of built-in vision algorithms for location, angle measurements, and part rotation validations. This machine simplifies the setup and operation of the machine, reducing the potential for errors and time spent on non-productive activities. In terms of accuracy, AD 809S is able to achieve a repeatable separation control within 0.0002 inches, with accuracy of placement within 0.001 of an inch. Furthermore, the equipment is capable of a maximum bonding process speed of 40 parts per second. Overall, ASM AD 809S is a high-precision, reliable, and accurate die attacher. It is designed to maintain a precise process and reduce labor costs while ensuring the highest levels of quality and performance. This equipment is an ideal solution for automated die bonding applications and can help significantly streamline production processes.