Used ASM AD 819-12 #9077234 for sale

ASM AD 819-12 is a die attacher designed for accurate and reliable attachment of chip scale packages. Using automatic self-centering and pre-defined seating zones, AD 819-12 can accurately attach die on to a wide range of package types. ASM AD 819-12 uses a unified platform to provide consistent features between different die sizes and package types. This unified platform allows for precise and accurate attachment to a wide variety of leadless chip scale package sizes ranging from 2 x 4 mm to 15 x 20 mm. Additionally, AD 819-12 is capable of attaching die on to a variety of package types such as TDFN, QFN, and CSPs. ASM AD 819-12 utilizes servo-controlled technology to align and attach die quickly and accurately. The automatic self-centering feature of this module insures that die is accurately and reliably aligned within pre-defined seating zones, ensuring that the die is attached with even pressure for maximum reliability. This servo-axis control allows for faster and smoother motion compared to traditional manual die attach systems, resulting in improved production speed and minimized die shift. In addition, AD 819-12 utilizes an advanced vision system to ensure that the correct die is properly placed and attached. Through the use of programmable parameters and advanced calibration technology, the vision system can verify that the die is correctly placed with accurate placement and bonding. ASM AD 819-12 also utilizes a die attach engine that is designed for reliable and constant performance. The die attach engine features an oil-less design for superior cooling, elimination of air entrapment, and improved reliability. This engine can be used for both manual and automatic die attaching, allowing for flexible operation when required. Overall, AD 819-12 is an accurate, reliable, and effective die attacher. By utilizing servo-controlled and vision-based technology, as well as an advanced die attach engine, this module is capable of attaching die on to a wide variety of leadless chip scale package sizes and package types. This ensures that accurate and consistent die attach can be attained regardless of the package type required.