Used ASM AD 829A #9169959 for sale

ASM AD 829A is a die attacher machine designed to precisely attach semiconductor die to its carrier. The attacher utilizes a patented capillary action vacuum equipment, offering precision and accuracy unattainable through traditional methods. AD 829A is an automated system that takes advantage of a series of motion elements such as motors, sensing devices and pneumatics to effectuate the die attaching process. Once the process is complete, a diaphragm-type vacuum custom-made vacuum cup applies a vacuum to the backside of the die and moves it to the X-Y axis. The vacuum is automatically released after the die is transferred onto the carrier. ASM AD 829A uses 4-axis motion (X-Y-Z-θ) to precisely control the angles and location of the die on the carrier. Once the die is in position and secured to the carrier, the external air is vented and the fixture is closed and sealed. AD 829A is equipped with several safety features including circuitry designed to detect conditions that may cause the machine to malfunction. It has programmable multi-layer detection to ensure that all components are in correct places before beginning the attach process. Additionally, it is outfitted with a heated pinch roller and an adhesive coating station for automatic die attach. ASM AD 829A is capable of handling a wide range of wafer sizes, ensuring that the entire process is as efficient as possible. It is also compatible with different kinds of adhesives, ensuring that die attach takes place the right way. Additionally, AD 829A is equipped with highly-customizable software, making it easy to accurately program desired parameters. It also has enhanced connectivity features, allowing rapid integration of the unit to other machines and 3rd party software. The machine offers detailed statistics on die attach accuracy and other related parameters. Overall, ASM AD 829A is an advanced, precise die attacher ideal for high-volume semiconductor production. With its accurate placement and quality assurance capabilities, it is highly reliable for most die attach applications.