Used ASM AD 829A #9200891 for sale

ASM AD 829A is a fully automated die bonder used for die attachment in power semiconductor semiconductor assembly. It is designed for high-speed die bonding applications and capable of bonding a wide range of dies including BGAs, flip chips, and MCMs. The tool is equipped with a vision system, laser inspection system, and high-speed pick and place capability to enable accurate and consistent die bonding. AD 829A features a placement accuracy of under 3 microns and a soldering cycle time of less than 70ms. This device is capable of mounting over 18,000 chips per hour and is capable of working with both lead-free and tin-lead solders. The tool utilizes a dual head independent tangential movement system which ensures optimal die to substrate alignment and precise die attachment. ASM AD 829A is also equipped with an intuitive touchscreen user interface for easy operation and configuration. Through this interface, users can specify bond parameters such as temperature, time, location, and power. The user-friendly interface also allows for process monitoring and analysis by displaying diagnostic alarms in real-time. AD 829A is a reliable and cost-effective tool for automatic die attachment in power semiconductor assembly. Its ability to bond a wide range of dies, high-speed soldering process and intuitive operation makes it an ideal choice for automated die bonding.