Used ASM AD 830 Plus #293609705 for sale

ASM AD 830 Plus
Manufacturer
ASM
Model
AD 830 Plus
ID: 293609705
Wafer Size: 6"
Vintage: 2014
Die bonders, 6" 2014 vintage.
ASM AD 830 Plus Die Attacher is an automated machine for the mounting and reworking of semiconductor dies with a high degree of precision and exacting specifications. The die attacher features a high degree of precision for the attachment of all semiconductor components, including paste, wire bonds, resistors, capacitors, and ceramic packages with flat tops and sides. ASM AD830 PLUS is driven by a powerful C80 processor with a 10° tilt head and three-axis motorized table for automated movable die attachment. It offers a robust scanning capability, capable of accurately and repeatably scanning glass, ceramic, plastic, and copper-based semiconductor components. It is also built with an ergonomic, compact design to accommodate easy integration into any production line or environment. AD 830 Plus has an easy-to-use graphical interface for operator control, featuring a touch-screen with integrated software programs for accurate die replotting and inspection. Programmable recipes allow for the integration of standard and custom tasks. The machine offers adjustable sensitivity and precision to all die reworks, enabling users to set up the machine according to their exacting requirements. In terms of maintenance and operation, AD830 PLUS is designed to operate with minimal intervention, requiring limited maintenance and usage of consumable parts. The machine is built with a high degree of robustness to withstand high temperature and shock to minimize operator safety concerns. It is equipped with an open-frame construction that allows for quick and easy access to internal components. Overall, ASM AD 830 Plus is a highly efficient and sophisticated die attacher that meets the performance and accuracy requirements of the semiconductor industry. It provides a user-friendly and rapid process that ensures both exact and repeatable die attachment. With its size and robust design, it is an ideal solution for the mounting and reworking of semiconductor components with precision, accuracy, and speed.
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