Used ASM AD 830 Plus #9251824 for sale

ASM AD 830 Plus Die Attacher is a high-speed automatic die bonding equipment designed for high-volume production in the semiconductor industry. This versatile machine is suitable for both large and small die attach applications, and provides superior thermal management with its advanced thermoresist technology. ASM AD830 PLUS features an ergonomic desktop design that can be easily integrated into production lines. Available with various options for automation and laser assembly, this die attacher provides excellent performance in a wide range of die attach applications. The weighted die carrier ensures efficient die loading even during high-volume production and the die pocket centering feature ensures accurate die placement alignment. AD 830 Plus also offers maximum precision when bonding die to a substrate, providing high-end thermal performance and accuracy. It has an excellent thermal management system, ensuring an optimal temperature for the die attachment process. The machine also has a fast melt speed and a thermal imaging camera, allowing it to accurately position and melt the heated wire. AD830 PLUS has a built-in software unit, which is easy to use and supports various useful functions such as interactive feedback, non-stop monitoring, and integrated thermal image processing. This software and the solder control machine help ensure that the heated wires accurately bond the die to the substrate. The die attacher provides great precision with its fine-pitch imaging tool. This asset is capable of accurately measuring and locating the solder points to provide maximum precision when bonding die to a substrate. Furthermore, ASM AD 830 Plus is equipped with a multi-axis robotic arm for precise wire bonding. The machine is also capable of performing various kinds of ball bonding and various thermo-mechanical die attach applications. Overall, ASM AD830 PLUS Die Attacher is a powerful, reliable, and accurate die attachment model designed specifically for the semiconductor industry. It is ideal for die attach applications that require precision, speed, and thermal performance. Its advanced thermoresist technology, software equipment, and high-speed process make it an ideal solution for high-volume production.