Used ASM AD 830 #293595164 for sale

ASM AD 830 is a state-of-the-art die attacher designed to quickly and accurately attach dies to substrates. It is highly precise and reliable, with a short attach time and consistent loop quality. ASM AD830 is an efficient and cost-effective way to attach complex die structures automatically. AD 830 uses an advanced combination of drive and vibration technology to quickly attach and form the die bond with a high degree of accuracy. This die attacher features a custom-designed end-of-arm tool that uses a combination of roller pressure and frequency to precisely and consistently attach the die to the substrate. The tool is capable of programming bounce frequency, dwell time, roller speed, and up to sixteen different attach steps to ensure that each bond is secure and handles various kinds of substrates. AD830 has the capacity to bond a wide range of chips, QFN packages and other components, as well as low-to-high height substrates. The motion technology employed by this die attacher complies with IPC-A-610D standards, ensuring that the substrate is never damaged. ASM AD 830 has a high level of repeatability and reliability, which ensures a consistent loop quality regardless of the size of the chip being attached. In addition, this die attacher has the capability to link to other machines in order to enable high-volume production of die-attached substrates. ASM AD830 is compact and lightweight, making it easy to install and transport. Its small dimensions and low power consumption make it a cost-effective solution for die packaging operations, as well as a great choice for lead-free processes. The die attacher is also backed by a two-year warranty, providing customers with peace of mind. All in all, AD 830 is an excellent die attacher for high volume die packaging operations. Its combination of precision and reliability makes it a great choice for those who need to quickly and accurately attach dies to their substrates.