Used ASM AD 830 #293605148 for sale

ASM AD 830 is an automated die attacher made by ASM Assembly Systems. It is designed to attach die to a substrate quickly, accurately, and reliably. The equipment solves the problem of tedious manual die attachment for applications such as flip chip, wire bonding, and wafer stacking. ASM AD830 is a high-precision die attacher that can be fitted with up to 8 die attachement modules. Each module is loaded with one die at a time, up to a size of 12.8mm x 12.8mm. The modules have a flat belt drive and an optic eye for precise die placement. The flat belt uses an encoder to ensure accurate die placement, and the drive is designed for reliable operation over extended periods of time. The system is designed for up to 8 dies per wafer, and the unit supports a maximum wafer size of 250mm. Additionally, AD 830 has a die position compensation feature which compensates for die shift due to vibrations and other effects during die placement. The machine is equipped with a user-friendly HMI (human-machine interface) with a color LCD display and a backlit keyboard. This allows the user to easily monitor and control the tool, including setting die position and parameters, monitoring die positions, and checking asset status. The model also includes a set of real-time process data collection and logging features, such as cycle counters and performance counters, that allow users to monitor equipment performance and maintain process quality. In addition, AD830 supports an in-line inspection system for die placement accuracy, with both 2D vision measurement and 3D laser scanning capabilities. This ensures that the unit is able to produce highly reliable and precise die placement results. ASM AD 830 is designed for reliable and accurate operation, and offers robust features for die placement accuracy. With its combination of multiple module support, precise die positioning, and comprehensive data logging, ASM AD830 is an ideal machine for automating manual die attachment processes.