Used ASM AD 830 #293605742 for sale

ASM AD 830 is an advanced die attacher machine commonly used in the semiconductor industry and one of ASM top-of-the-line models. This die attacher uses advanced dispense technology to accurately place dice onto substrates with extremely high accuracy and reliability. ASM AD830 is designed to be used in medium to high volume applications with a broad range of substrates and die sizes, from 0.1mm to 25mm and from JEDEC to high-DRAM test substrates. It is also equipped with many features for optimal efficiency, including Automatic Positioning Control (APC), Automatic Size Adjustment (ASA), Automatic Orientation Control (AOC), and Windows-based software control. AD 830 is highly automated and provides simple, efficient operation. Its chassis is made of stainless steel and aluminum, delivering maximum reliability and durability. The machine also offers two primary operating modes: manual and automatic. The manual mode allows the operator to set the die size, position, and attachment parameters, while the automatic mode fully automates the die-attachment process, with the machine selecting the optimal parameters based on the die size and positions. AD830 uses advanced vision systems, including high-precision digital cameras and custom algorithms for precision alignment. The machine also features a high-speed measurement system with an embedded thermocouple for automatic temperature control. Its die-placement accuracy is 0.02mm, and its die-position accuracy is 0.003mm—ensuring that the dies are placed with high precision and accuracy. ASM AD 830 also uses a variety of high-resolution photo sensors to allow for quick, real-time die detection and allows for replaceable punches for maximum flexibly in die sizes. Its unified software mechanism ensures that there are no system malfunctions or downtime due to software issues. The machine also provides maintenance and service utility programs, allowing it to be easily serviced and maintained. Overall, ASM AD830 is highly reliable, accurate, and efficient, making it the perfect solution for medium to high volume applications requiring accurate die attachment. It features advanced features, such as Automatic Positioning Control (APC), Automatic Size Adjustment (ASA), Automatic Orientation Control (AOC), and Windows-based software control, enabling simple and efficient operation. It also offers a high-precision measurement system and support for replaceable punches for maximum flexibility.