Used ASM AD 830 #293629349 for sale

ASM AD 830 is a state-of-the-art die attacher specifically designed for the production of semiconductor dies. ASM AD830 ensures precision die placement and uniform bond strength to maximize component reliability and product life. This advanced die attacher features a robust and reliable design, with a precision X-Y table and motorized Z-axis that allow for accurate die placement and ultra-low die placement tolerance. AD 830 also has a die staging mode, which allows for two dies to be placed simultaneously to reduce cycle time. Additionally, the fast-cycle actuator moves the die in milliseconds to reduce tool setup and tear-down times. AD830 is equipped with a digital control feature and a vision system for exact measurements. The vision system ensures accurate and repeatable results, and provides images of the die and its placement that can be captured and saved for future reference. The digital control feature provides an interface for consistent and repeatable operation, adjustable pressure settings, and an offset compensation feature to improve efficiency. ASM AD 830 die attacher is capable of accommodating a variety of die sizes—from .5 to .35mm—and can be used for both flip chip and wire bonding processes. This versatile, versatile die attacher also features air cooling systems, light blocking components, and haptics, which provide tactile feedback for a more efficient die placement process. ASM 830 is constructed with a sturdy stainless steel body and a durable aluminum frame. The system also provides a user-friendly interface and manual input options, which allow users to select the right settings for each die placement. Plus, it has a compact design, which ensures space efficiency in enterprise applications. ASM AD830 is a highly reliable and accurate die attacher, making it an ideal choice for die placement processes. Its high-precision and repeatable results, customizable settings, robust design, and versatile features are sure to drastically improve the reliability and performance of semiconductor-based products.