Used ASM AD 830 #293635918 for sale
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ID: 293635918
Wafer Size: 6"-8"
Vintage: 2010
Die bonder, 6"-8"
CCD
Magazine to magazine
2010 vintage.
ASM AD 830 is a high-precision die attacher designed for reliable die attaching operations in manufacturing and other industrial applications. It is well-suited for environments requiring precision and accuracy in the attachment of small components, particularly various types of packaging, such as labels and foil. ASM AD830 die attacher uses a two-stage process to ensure perfect and secure adhesion of die to substrate material. First, the die receiving unit applies positive pressure to the die and preheats it quickly to a predetermined temperature. This pre-heating step allows for tight adhesion of the die to the material, as well as optimal curing of the adhesive used to secure the material together. The second stage of the attachment process is the pressure application. AD 830 applies pressure to the die using its pressing control system, which allows for accurate and repeatable pressure control. This ensures a secure attachment of the die to the material, creating a trusted and durable bond. AD830 die attacher is equipped with several features to help reach the precision required in creating reliable die attachments. It is equipped with a color touchscreen interface and a range of emulation and diagnostic tools, making it easy to set up and run die attaching processes with accuracy. Additionally, the device is equipped with an advanced tracking and fault detection system, which helps reduce errors and ensure reliable performance. The innovative design and ease of use of ASM AD 830 make it a highly reliable, stable, and secure device for die attaching. It allows for accurate and efficient attaching processes, ensuring successful and durable die production. Additionally, its safety features and tracking capabilities make it the ideal choice for a wide range of industrial applications, ranging from packaging to small components.
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