Used ASM AD 830 #293649790 for sale

ASM AD 830 is a die attacher designed for use in the semiconductor package assembly process. This machine is capable of selectively attaching die, such as ICs (Integrated Circuits) and MEMS (Microelectromechanical Systems) using a combination of vacuum, heat and pressure. The machine is equipped with a highly precise CCD (Charged Couple Device) vision system that can identify and accurately position die for attachment. ASM AD830 is designed for high speed and low cost operation, with a die attaching capability of over 400 die per hour. The machine offers multiple configurations, including options for selective backside coating and anti-static coating application. AD 830 also features an intuitive operator interface, allowing quick and easy programming. The integrated Ethernet network communication interface also allows remote access, making troubleshooting and maintenance easier and more efficient. The vacuum pressure used by AD830 is generated by oil-free rotary vane pumps, providing the power necessary to securely and accurately attach die to substrates. These pumps are driven by servo motors, providing precise control and feedback, as well as variable speed operation. The system can also be programmed to accurately apply a fixed heat and pressure to each die, depending on the requirements of the application. This feature is especially useful for providing uniform adhesion of die to substrates. The main body of ASM AD 830 is a modular aluminum chassis, designed for quick and easy installation and maintenance. The chassis is also designed to withstand high temperatures and corrosive materials, making ASM AD830 suitable for a wide variety of semiconductor assembly applications. Overall, AD 830 is a highly efficient and reliable die attacher for semiconductor package assembly. The machine is designed for speed and accuracy, as well as cost efficiency and easy maintenance. Its robust construction and precision features make it suitable for a wide variety of applications.