Used ASM AD 830 #293672046 for sale

ASM AD 830 is a high-quality, high-precision die attacher designed for attaching dies and sockets to semiconductor packages and boards. It is designed to achieve consistent die placement accuracy and quality, with minimal human intervention. It is capable of precisely and accurately attaching both lead frames and flip-chip dies and has various configurations for different needs. ASM AD830 has a three-axis positioning system that enables it to move in the X, Y, and Z axes for precise die positioning and placement. It also has an optional sub-axis stage that increases its accuracy and speed. The die pick-up station uses a vacuum blade to pick-up dies securely. AD 830 can be integrated with automatic die sorting systems for efficient die availability. The die attachment speed can be adjusted to suit the application, and a dual-zone die placement is also available. AD830 is operated with a user-friendly graphical user interface. It is equipped with sensors that detect various parameters such as die position, temperature, and force. These sensors help to minimize potential errors and get accurate die placement. ASM AD 830 also has an integrated vision system which can be used for automatic placement verification. ASM AD830 has a small footprint and is easy to integrate into existing production lines. It helps increase productivity and reduce costs associated with manual die attachment. It is also highly reliable and can operate without any technical expertise. AD 830 is designed to meet the needs of industrial production and process control. With its precise and accurate die placement, AD830 is ideal for applications such as flip-chip die attach, die assembly, and module assembly.