Used ASM AD 830 #293706809 for sale

Manufacturer
ASM
Model
AD 830
ID: 293706809
Vintage: 2010
Die bonder 2010 vintage.
ASM AD 830 is a specialized machine that is specifically designed for die attaching, a unique fabrication process used in the communications and electronics industries. Essentially, die attaching is the bonding of semiconductor devices to a substrate or to a ceramic circuit board. ASM AD830 is the latest model of a die attaching machine from ASM, and is capable of micro-soldering, die attaching, and die-to-die connecting. The machine is driven by a dedicated servo motor, providing optimal control and precision with a capacity up to 30 watt peak. The machine is designed to offer top-level process quality, with equipment that provides a reliable and realistic cookbook appr oach to the die attach process. The machine also guarantees a fast process ramp-up and superior yield, thanks to a number of pre-programmable program selections, including high-precision position and pressure programming, in addition to re-flow profile management. The machine has a compact operational window, allowing operators to monitor the process without issue. It also guarantees repeatability and reliability on all application types, such as entry-level, mid-level, and high-end applications. The machine utilizes a three-zone design for optimal control and stability, including a nitrogen chamber for purging nitrogen or other clean gases in order to limit thermal oxidation. In terms of its structural design, AD 830 features a high-precision linear guideway rail and slide table which provides the highest-level motion stability and accuracy. It is compatible with most standard die sizes, and can accommodate devices up to 25mm x 25mm in area. The machine also includes a sensor for monitoring process feedback, as well as integrated safety features to protect both operators and machine components during operation. Overall, AD830 is a highly advanced and reliable die attaching machine designed to maximize process quality, reduce cycle time and achieve the highest yield. It is optimized for high precision and repeatability, and is suitable for all types of die attach applications.
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