Used ASM AD 830 #9099846 for sale

ASM AD 830 is an automated die attach machine that is used for attaching die to substrates. It is a high precision device designed for die bonding of various types of substrates such as rigid, flexible and hybrid substrates. The machine consists of vacuum-based die pick-up station, die placement head, and die attachment head. It is equipped with an automatic feeder equipment and advanced controllers that ensure accurate and reliable bonding of different shapes and sizes of die. The die pick-up station is designed to pick up die with vacuum force and move the die to the next station. The die placement head can precisely position the die and can be used for manual as well as automatic positioning. The die attachment head has a dispense system that dispenses adhesive on the die and substrate. The machine also contains various components such as power supply, control panel, air compressor, and sensor unit. The machine's advanced controllers and sensors can measure the size and position of die, control the flow of adhesive, and ensure the correct bonding of the die. It is capable of controlling the motion speed, pressure, temperature, and humidity, while attaining consistent bonding with various substrates. The accuracy of the machine is further enhanced by its built-in vision unit which checks the bond integrity. ASM AD830 is suitable for most types of die attach applications. Its accurate positioning and bonding quality results in short bonding cycle time. The machine works at high speeds up to 3,837 individual placements per hour and can handle different substrate sizes such as 3x3mm to 28x28mm. Its ergonomic design is suitable for wafer level packaging applications and its low maintenance and cost-effective design makes it an ideal choice for semiconductor industry. The machine is also equipped with safety and protection features such as a crush prevention machine, over-pressure and overload protection, and die type recognition tool. This ensures the safety of the operators and the product during the bonding process.