Used ASM AD 830 #9176610 for sale

ASM AD 830 is an automated die attach machine designed to perform accurate assembly of miniature IC components to substrates with a high degree of precision. The machine is user-friendly, has a quick exchange time, and is equipped with a wide range of features to ensure consistent quality of assembly. ASM AD830 comes with an integrated vision equipment that makes it easier for the operator to obtain accurate placement and alignment. This die attach machine is capable of attaching lead frames, leadless chips, and die to encapsulated chips to a variety of substrates. It also has a built-in real-time system that alert the user of any problems through audible signals, while allowing them to monitor the process of assembly online. The machine is equipped with two stages of work: pick-and-place and auto inspection. The pick-and-place stage involves use of specialized tools that enable accurate and rapid placement of the IC components and lead frames onto the substrate. The auto inspection stage uses a high-resolution image acquisition unit to accurately detect defects in each die. The machine is capable of processing highly complex and challenging assembly jobs without any difficulty and operates with five degrees of freedom for precise positioning. AD 830 offers up to 150mm of PCB width, 8mm of depth travel, 200mm of working area, and up to 4 lines of dispense points. The temperature of the machine can be regulated between 0 to 70 degrees Celsius, and its dot accuracy is within 0.1mm. The machine is also equipped with a control machine that allows the operator to program and customize the assembly process as needed. Furthermore, this machine is designed with safety in mind; it includes safety interlocks that are connected to a safety switchboard, as well as an emergency stop button. An RS-232 interface is also included in the machine to make communication with a PC easier and more efficient. All in all, AD830 is a reliable and efficient die attach machine that comes with a wide range of features to ensure quality assembly of IC components and die to substrates. It is ideal for use in the fields of semiconductor assembly and production.